Precision Laser Cutting & Dicing Service
YMJ provides advanced laser micro cutting and dicing services using ultrashort pulse (femtosecond) laser technology, delivering ultra-high precision, clean edges, and superior surface quality across a wide range of materials.
Our laser cutting solutions are ideal for hard, brittle, ultra-thin, transparent, and sensitive materials, where conventional mechanical or thermal processing cannot meet quality requirements.
We support both rapid prototyping and mass production, with flexible customization based on your drawings and technical specifications.
Key Advantages
- Ultra-high precision with ±5 μm tolerance
- No heat-affected zone (cold processing)
- No micro-cracks, chipping, or edge damage
- Smooth cutting edges with minimal post-processing
- High-speed processing for production efficiency
- Suitable for complex geometries and micro-scale features
Technical Capabilities
| Parameter | Capability |
|---|---|
| Precision | ±2–5 μm |
| Cutting Thickness | 0.03 mm – 1.3 mm (depending on material) |
| Min Feature Size | ≥1 μm |
| Surface Roughness | Ra < 1 μm |
| Cutting Speed | Up to 200 mm/s |
| Processing | Femtosecond Laser (Cold Ablation) |
Materials & Applications
Glass Cutting & Dicing
YMJ offers high-precision glass laser cutting for both tempered and non-tempered glass, optimized for different material properties.
Capabilities:
- Tempered glass: 0.3 – 1.3 mm
- Non-tempered glass: 0.03 – 1 mm
- DOL: 10–80 μm (depending on thickness)
Features:
- Smooth edges with no visible cracks
- Minimal or no post-processing required
- Straight and complex cutting paths
- Easy separation after processing
Sapphire Cutting & Dicing
We provide precision cutting for sapphire and ruby materials used in optical and electronic applications.
Capabilities:
- Thickness: 100 μm – 760 μm
Features:
- No edge chipping or cracks
- High surface quality (Ra < 1 μm)
- Stable and repeatable process
- Suitable for complex shapes
Polymer Micro Cutting
Optimized for thin films and heat-sensitive materials, ensuring high precision without deformation.
Materials:
- PET, PBT
- COC, BICOR films
- Polyester films and foils
Capabilities:
- Thickness: 8 – 250 μm
- Tolerance: ±2 μm
Features:
- No discoloration or thermal damage
- Sub-micron precision
- Smooth edges and excellent surface finish
Thin Films & Foils Cutting
Laser cutting using cold ablation is ideal for ultra-thin materials requiring precision and cleanliness.
Features:
- Minimal or no discoloration
- No heat-affected deformation
- High-speed processing
- High edge quality and accuracy
Why Choose YMJ
- Advanced femtosecond laser cutting technology
- Strong expertise in brittle and ultra-thin materials
- High precision and consistent quality
- Support for OEM / ODM / custom drawings
- Rapid prototyping with short lead times
- Continuous equipment optimization with professional laser partners
Applications
Our laser cutting and dicing services are widely used in:
- Consumer electronics (cover glass, displays)
- Semiconductor and IC components
- Optical and photonics devices
- Medical devices and microfluidics
- Precision engineering components
- Automotive and aerospace parts
FAQ
What is laser micro cutting?
Laser micro cutting uses ultrashort pulse lasers to achieve high-precision cutting with minimal thermal impact, ideal for delicate and micro-scale components.
Can you cut ultra-thin glass without cracking?
Yes, YMJ uses femtosecond laser technology to ensure crack-free cutting with smooth edges, even
for ultra-thin glass down to 0.03 mm.
What materials can be processed?
We process glass, sapphire, polymers, thin films, metals, and other advanced materials.
Do you support custom cutting projects?
Yes, we support custom designs, OEM/ODM services, and customer-supplied materials.
Get a Quote
Looking for a reliable laser cutting service supplier?
Send us your drawings or technical requirements today.
YMJ will provide a fast quotation and optimized cutting solution.
Contact us now to start your project
